ISRO Electronics & Communication (ECE) 2016 - Question 49

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Topic: Electronic Devices and Circuits

Silicon dioxide is used in ICs

  • A. Because it facilitates the penetration of diffurants
  • B. Because of its high heat conduction
  • C. To control the location of diffusion and to protect and insulate the Si Surface
  • D. To control the concentration of diffurants

Answer: C. To control the location of diffusion and to protect and insulate the Si Surface

Explanation: In IC fabrication, the $\text{SiO}_2$ layer serves as a high-quality insulating layer, provides surface passivation to protect the silicon surface, and acts as a photomask to selectively block dopants and control the location of diffusion.

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